During mechanical sawing, laser grooving, and high-pressure deionized water flushing, thinned semiconductor wafers must be held securely on metal or plastic carrier frames to prevent die flying, edge chipping, and water seepage beneath the cut parts. Following the singulation sequence, the individual dies must be cleanly released from the carrier tape during automated pick-and-place die bonding without leaving adhesive residue or causing mechanical die cracking. Addressing these mounting requirements, the Wafer Dicing Tape industry supplies engineered pressure-sensitive and radiation-curable adhesive films. Laminated onto the backside of processed wafers, dicing tapes provide high initial holding adhesion during high-shear blade cutting, combined with controlled release properties that enable automated die ejection.

Technologically, modern dicing tapes are divided into conventional non-UV pressure-sensitive tapes and advanced ultraviolet (UV) curable tapes. UV-curable dicing tapes utilize specialized acrylic adhesive layers containing photo-initiators and multi-functional oligomers coated onto flexible polyvinyl chloride (PVC) or polyolefin (PO) base films. During wafer sawing, the tape maintains high adhesive peel strength (often exceeding 5 to 10 N/25mm), securing even microscopic sub-millimeter dies against hydraulic coolant sprays. After cutting, exposure to ultraviolet radiation initiates rapid photo-polymerization, cross-linking the adhesive matrix into a hardened three-dimensional network. This photochemical transition slashes peel adhesion by more than 90% (down to 0.1 to 0.2 N/25mm), allowing die-attach needle ejectors to push dies upward smoothly without micro-cracking thin silicon dies. Furthermore, modern dicing tapes integrate anti-static additives to prevent electrostatic discharge (ESD) build-up during tape peeling, protecting sensitive transistor gate oxides.

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